ADVANCED ANALYSIS / TEST

X-Ray

    X-Ray

    • X-rays are electromagnetic waves with wavelengths between 10-11 and 10-9 meters and have a strong transmission power to the material.
    • When transmitting a material, the transmittance varies depending on the component (component)-density of the material, and the X-Ray analysis system is used as a non-destructive inspection equipment using this principle.
    • Lead frame, Au, Cu wire form and defect pattern of semiconductor/electronic component internal structure can be checked, and solder ball void ratio can be checked in SMT area.

    Apply Analysis

    • Internal structure
    • Non-destructive defect analysis
      Wire Melting
      Wire Open
      Lead Frame
      SMT Fill Rate
    • Solder void measurement

    Equipment Specifications

    Analytical equipment details
    Manufacturer/Model Name : SEC/ SEC / X-Ray 5000B By SEC
    1. X-Ray tube Voltage : MAX 130kV
    2. X-Ray tube Current : MAX 400uA
    3. Magnification : up to 1000x
    4. Sample Loading Stage : 500x 400mm
    5. Measurement Stage Size : 350mmx300m
    6. Measurement Min Size : 2um

    Analysis Examples

    • Check internal structure
      Lead Frame, Bonding Wire
    • Melting
    • Short
    • Loop Abnormal