ADVANCED ANALYSIS / TEST

Circuit Edit

    Circuit Edit

    • Metal line cutting in semiconductor IC, connect to modify circuit
    • Ion Beam can be injected to etch into the desired area/form (Metal Line Cutting, Oxide Etching), metallic materials (W, Pt, etc.), and nonconductive materials (C, O) can be increased to the desired form.
    • The circuit modification of the IC can be carried out using the function of etching and deposition, which is easy to correct design abnormalities.
    • Circuit correction can be utilized to reduce time and cost for process changes and verification.

    Apply Analysis

    • Metal-Metal Deposition
    • PAD
    • Metal Cutting

    Equipment Specifications

    Analytical equipment details
    Manufacturer/Model Name : 1540 EsB / CARL ZEISS
    1. Resolution : 7nm @ 30kV guaranteed, 5mm achievable
    2. Magnifcation : 600x - 500kx
    3. Probe Current : 1pA - 50 nA
    4. Emitter : Ga liquid metal ion source(LMS)
    5. Detectors : In-column : Esb with fitering grid(BSE) Fitering grid voltage 0 - 1500V
    6. Operating pressure : 5 x 10 - 5 mbar or lower
    7. Specimen Stage : 6-axes fuly exxentric, all motorized
    8. Gas Injection System : Up to 5 gases for selecive Etching, enhanced etching, material deposition, Insulator deposition

    Analysis Examples

    • Metal Cutting
    • Pattern PAD Formation
    • Metal Cutting, Deposition